Electrical signals can be multiplexed over a wire or a line, but many laser frequencies can be multiplexed over a waveguide. This allows information processing power to be increased by a factor of 1,000 while being unaffected by magnetic and electric fields, such as electronic signals. 

Integrated optical panels and backplanes are expected to grow steadily over the next few years. ElectroniCast forecasts that the total production value of rigid and flexible optical boards will reach $3.965 billion by 2020. The need to route long line optical signals in an efficient manner and at low cost has attracted attention to integrated optical waveguides and optical routing methods. The current method of signal routing is to convert an optical signal to an electronic signal, query it, switch it to the next destination, and then convert it back to an optical signal. All of this creates what the industry calls "terabit routers," requiring large, complex multilayer circuits with as many as 42 layers. For integrated optical devices, this may need to be done by one or two unique PCB components. "Board-to-board" photoelectric system is shown in Figure 4.

In the value supply chain, the design process is as important as the manufacturing process. The most important components and manufacturing technologies to be developed are as follows:

· Optical waveguides and technology for integrating them into PCBS

· Electro-optic and electro-optical converters for realizing optical transmitters and receivers, and 

- Realize robust coupling concept of optical element to board connector

- Board-to-board connector

- Board to optical fiber connector

The following tools, models, algorithms, and methods are necessary to provide effective design of opto-electronic printed circuit boards:

· Support time-domain simulation models and algorithms;

· Optical interconnection simulation;

· Wiring and general design rules for optical interconnects and the entire optoelectronic circuit board, and methods for analyzing and optimizing the optoelectronic printed circuit board in terms of functional, technical and cost requirements.

Many technologies are being developed, including multimode waveguide lamination, through-hole optical coupling, surface treatment, and welded connectors.

This integrated optoelectronic component requires many new considerations for the PCB:

· Optical waveguide material

· 3D production technology

New components,

· 3D assembly technology

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