In the era of cloud computing, artificial intelligence and 5G, manufacturers have to face the following challenges in order to cope with applications such as multi-chip flip chip and complex system packaging:

§ High capital investment

§ To assemble chips and passive devices on modules

§ The overall equipment use efficiency is low

High mixing, new products into the environment

Global Instruments' FuzionSC semiconductor SMT machine has become the preferred choice for multi-chip flip chip and system packaging with the following advantages:

§ Can handle 8 different wafer direct feeding at the same time

Support wafer, strip, Jedec/ disc, and tube feeder

Attaching speed up to 16K per hour

§ Can handle 008004 to 150mm components

The five sacred objects of FuzionSC

VRM linear motor positioning system

Highly accurate (1µm resolution), closed-loop positioning controls support current, converged, and emerging technologies

High acceleration -- up to 2.5g

Double drive architecture, reduce the stabilization time

FZ placement head

§ Accurate accuracy (10 microns; 1)

§ 008004 to 150 square mm (multiple video), up to 25 mm

High-speed IC and chip mount, group pick up up to 7 components

§ Standard Package Stack function (PoP)

Magellan digital camera

§ Support all flip chip and surface mount components

§ High resolution up to 1024 x 1024 ensures identification of fine features

§ 2.3, 0.94, 0.5, 0.2MPP (support 20 micron ball/copper column)

Linear film applicator (LTFA)

§ A thin layer of flux, solder paste and adhesive may be produced

§ Two linear film coaters can be configured to support simultaneous dipping of 7 shafts

§ Programmable scratch loop, dip resident and maintenance monitoring

§ 8 hours extra capacity, fast replacement, touch sensing

Fast and accurate PEC camera

§ High resolution (.27MPP)

§ Programmable lighting, wavelength lighting, cross-polarity light source

§ Identification of standard/adjustable reference points and pads

Demo：

FuzionSC semiconductor SMT machine with high speed feeder, feed up to 16K per hour, can ensure up to 16K per hour mount speed.

High speed wafer feeder unique functions and advantages:

§ 14 high precision (submicron X, Y, Z) servo-driven pickup heads

§ High precision (submicron X, Y, Z) servo drive pin

§ 100% visual and chip calibration before pickup

§ One-step "wafer to mount" switch

§ Synchronous wafer stretching and storage

§ Dual wafer platform speeds up to 16K per hour

§ Assemble the largest size range of chips and ultra-thin chips

§ Four times faster than existing equipment

§ Can handle the largest size of substrate

Fuzionsc2-14 Technical parameters

Mounting speed (CPH)

30,750 (Max) / 14,200 (4-board IPC chip)

Precision (including m @ & gt; 1.00 Cpk)

±10 (Array element/flip chip) / ±25 (Passive element/chip)

Maximum size of circuit board

813 x 610mm (32" x 24"), can be fitted with larger plate special features

Maximum feeding station (8 mm)

120 (2 ULC)

Feeder type

Wafer grade (up to 300mm), disc, reel, tube and bulk

Component size range (mm)

(008004).25 x.125 (minimum) to 150 square mm (multiple video), maximum 25 mm

Minimum ball size and pitch (µm)

Ball size: 20µm, ball spacing: 40µm

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Welcome more people to discuss with us about SMT technologies and solutions, please contact us for more information:

Tel: +86 13670124230 (WhatsApp/Skype/WeChat)

Email: etasmt@foxmail.com