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    SMT area

    How To Set Profile In I.C.T Lyra Series Reflow Oven 7

    From:    Author:Mark Hardy    Publish time:2021-09-02 09:08    Clicks:2

    4. Requirements for PCBs to be tested

    (a) In principle, it should be made from the entire reflowed products suitable for this reflow machine to ensure its temperature changes

    within the reflow oven are reflected really.

    (b) If substitutes are used, they should meet the following requirements: The same base-panels, the same base-panel sizes, the same

    base-panel thicknesses, almost the same number of components, and similar heat ab sorptivity or heat resistance of components.

     

    I.C.T is a manufacturer of SMT machines. It mainly provides customers with SMT production lines including SMT Stencil Printers,  Pick and place machines, Reflow Oven, AOI Machine, Wave Soldering Machine and PCB Handling Machine etc. I.C.T has more than 25 researches on SMT and DIP technology,  for the world Customers provide SMT total solutions. There are successful cases of SMT technICal team in Asia, Europe, AmerICa, AfrICa, and Australia.
    I.C.T provide SMT solutions at various stages according to the different needs of customers. I.C.T is not only a provider of SMT equipment and technology, but also is the customer's escort in the field of SMT and DIP.
    Welcome more people to discuss with us about SMT technologies and solutions, please contact us for more information:
    Tel: +86 13670124230 (WhatsApp/Skype/WeChat)

    Email: etaSMT@foxmail.com
     

    5. Other precautions

    (a) When PCBs and memory device are placed together into the oven, attention shall be paid that distance between memory device and

    PCBs should be above 100mm to avoid heat disturbance.

    (b) Relevant experimental data show that reflow oven can only achieve oven-body heat balance after starting up for 30 minutes. Therefore,

    profile test and formal production can only be started after oven has been run for at least 30 minutes.

    (c) After profiles are printed out, equipment should be adjusted, based on preheat temperature and time, reflow peak temperature, reflow

    time, temperature rise and cooling rates and so on, until profile requirements are met. Due to different heat capacities of various test points

    as well as non-uniformities of characterized reflow oven temperatures, certain differences among three test points' profiles will still exist.

    (d) Records of profiles: In addition to printing out profiles, scopes and actual values of their parameters, device's settings, test points'

    location distributions, PCBs' entrance directions, testing times, test results and judgments, etc. should also be recorded.

    (e) Measurement frequency: In principle, tests are performed once a week (or based on customers' requirements). If settings or products

    are changed, tests are needed for new profiles.

     

    SMT Line PCB, SMT Full Line,  Dual Squeegee Semi-Automatic Stencil Printer,  Desktop Stencil Printer SMT Automatic, Reflow Oven Profiler, Manual SMT Reflow Oven, Wave Soldering Machine Nozzle, Wave Soldering Machine With Flux, Hanwha Pick And Place PCB Machine, Pick And Place Machine 2 Head, Vaccume SMD Pick And Place Machine, SMD Pick And Place Machine, Vision Camera SMT Pick And Place, Panasonic Pick And Place Splicing Tape, Pick And Place Machine For Packaging, DIP Capacitor Pick And Place Machinery, Conformal Coating Machine Selective, LED Shell Automatic Coating Line, PCBA Conformal Coating Line, Desktop PCB Router Machine, Router Power Backup PCB, CNC Router PCB Board, CNC PCB Router Drill

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