SMT chip mounter
High Speed Flexible Mounter
As a general component placer whose vision system is reinforced based on the platform of the SM471 high speed chip shooter and whose chip placement speed is the highest among the same class component placers, the SM481 realized a chip placement speed of 39,000 CPH, the highest among the same class component placers, by applying a head with one gantry and ten spindles as well as new flying vision and by maximizing the pickup and placement motion. In addition, it is applicable up to 0402(01005 inch) chips and □42mm ICs. It has improved actual productivity and placement quality by applying high speed and high precision electrically driven feeders. Furthermore, since it is designed to be compatible with SM series pneumatic feeders, it maximizes the customer’s operational convenience.
Fresh Energy in Your Business
39,000 CPH(Optimum)
1 Gantry x 10 Spindles/Head
Applicable Parts : 0402(01005 inch)
~ □42mm(H15mm)
Applicable PCB : 460(L) x 400(W)(Standard)
Max. 740(L) x 460(W)(Option)
High Speed, High Precision and Electrically
Driven Feeder
- Automatic pick-up position alignment function
- Compatible with SM pneumatic feeders
New Vacuum System and Optimized Pickup/ Placement Motion
SMART Feeder
- World’s first Auto Loading and Auto SplicingAdvanced High Speed Flexible Mounter
Realizes Super-high Placement Speed of 39,000 CPH
Realizes the highest placement speed among the same class chip placers by applying a new flying head mechanism with 10 spindles as well as optimized pickup/placement motion
Since it allows part recognition without stopping after part pickup by applying its original On-the-Fly image recognition technology, the SM481 model maximizes the part placement speed by minimizing the time to move between the pickup position and placement position and by reducing the recognition time to almost zero.
Applies a New Vacuum System
of pneumatic path
consumption by applying a vacuum pump
※Air consumption is less than 50Nl/min when using a vacuum pump. Electrically Driven High Speed
Placement accuracy correction system
Chip ±50μm(Cpk ≥1.0)
The newly upgraded placement accuracy calibration system automatically checks and corrects the pickup point offset, head offset, C/V offset, etc.
to allow reliable part placement.and High Precision Feeder
Electrically driven SM feeder
Allows integrated use of 0603/2P/4P Equipped with a function to automatically align
the pickup position between feeders to improve
the simultaneous pickup rate.
Able to set various part supply speeds toimprove the stability of part supply. Automatic feeding pitch recognition function ※Compatible with SM pneumatic feeders
SM smart feeder
The world’s first feeder equipped with Auto Splicing and Auto Loading functions
- Maximizes work convenience and actualproductivity by automating the splicing process for part reel replacement normally performed by hand.
Applicable to reels with a small quantity of parts ※Compatible with SM pneumatic feeders
Absolute Accuracy of±50μm(Cpk 1)
0.08 0.06
0.04 0.02
□42mm(H15mm) as well as BGA/CSP parts
Present Reel New Reel
Reinforced Applicability to Parts and PCBs
Specifications
Alignment
Number of Spindles
Placement Speed
Placement Accuracy
Component Range
Board Dimension (mm)
Feeder Capacity
Utility
0.00
-0.08 -0.06 -0.04 -0.02 0.00 0.02 0.04 0.06 0.08
10 Spindles x 1 Gantry
39,000 CPH(Optimum) ±50μm σ/Chip, ±30μm σ/QFP
(Based on the standard chips)
0402(01005 inch) ~ □16mm IC, Connector(Lead Pitch 0.4mm) * BGA, CSP(Ball Pitch 0.4mm)~ □16mm IC, Connector(Lead Pitch 0.3mm) * BGA, CSP(Ball Pitch 0.4mm)
~ □32mm IC, Connector(Lead Pitch 0.4mm) * BGA, CSP(Ball Pitch 0.5mm)~ □32mm IC, Connector(Lead Pitch 0.4mm) * BGA, CSP(Ball Pitch 0.5mm)
~ □42mm IC, Connector(Lead Pitch 0.5mm) * BGA, CSP(Ball Pitch 1.0mm)50(L) x 40(W)
Model
SM481
-0.02 -0.04
boards applied to LEDs and displays
position by being equipped with a fiducial camera at the left and right respectively
Applies a New Illumination System
Reinforced applicability to odd-shaped parts including BGA, CSP, etc., by applying three-staged illumination systems(Side, Coaxial and Outer illumination).
-0.0
-0.08
6
Chip/QFP
Flying Vision
FOV 24
Stage
Vision (Option)
FOV 35
Max. Height
FOV 45
Minimum
Maximum
460(L) x 400(W)
610(L) x 510(W)(Option)510(L) x 460(W)(Option) 740(L) x 460(W)(Option)
PCB Thickness
Power
Air Consumption
Mass
0.38 ~ 4.2
120ea / 112ea(Docking Cart)AC 200 / 208 / 220 / 240 / 380 / 415 V (50/60Hz, 3Phase) Max. 4.7kVA
0.5 ~ 0.7MPa(5 ~ 7kgf/cm2) 180Nl/min, 50Nl/min(Vacuum Pump)
Approx. 1,655kg
1,650(L) x 1,680(D) x 1,530(H)