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Hanwha SMT Production Line
1. We provide fulL SMT solution for you
2. We provide core technology with our equipments
3. We provide the most professional tech service
4. We have wealthy experience on SMT factory setup
5. We can solve any question about SMT
Hanwha Semiconductor Equipment Smart Flip Chip Machine SFM3
3rd Generation
Smart Flip Chip Machine
▶ 2 Spindles/Head * 2 Gantry
▶ Speed : 7.0 k UPH (Optimum)
▶ Accuracy : ±5㎛@3δ
▶ Die Size : ㅁ0.5 ~ ㅁ32mm
▶ Die Thickness : Min. 40㎛
▶ Wafer Size : up to 12"
▶ Substrate Size
- 330(L) x 330(W)mm (1 Conveyor)
- 330(L) x 166(W)mm (2 Conveyor)
▶ Dimensions : 1,681(W) x 1,460(D)
▶ C2W, FOWLP
The ELITE system can easily perform part library teaching and various recognition tests off-line under the recognition environment identical to that of a chip mounter. In addition, it can improve the part placement quality and increase productivity of the machine by minimizing the machine operation loss caused by the part registration and the possibility of defective recognition.
High quality SMT line machine Hanwha pick and place, Hanwha SMT machine, Hanwha SM485P, Hanwha techwin pick and place machine, Hanwha SMT placement machine, for PCBA OEM factory.
As a Hanwha SM471 plus with two gantry with 10 Spindles, Hanwha SM 471 plus is the Hanwha High speed pick and place, Hanwha pick and place, Hanwha pick and place machine, Hanwha techwin pick and place machine, Hanwha SMT placement, with 78000 CPH.
As a SMT chip mounter, as a flexible mounter, Any item can be produced for smart production. Hanwha chip mounter Decan F2 as a new model, it can mount 0402~□55mm (H15mm) components, for LED TV production line.
Hanwha flexible SMT machine pick and place machine, Hanwha SMT pick and place machine, Hanwha placement, Hanwha chip shooter, Hanwha SMT chip shooter with 92,000 CPH, 20 head.
Hanwha advanced multi-functional Placer DECAN L2, Hanwha SMT placement machine, Hanwha chip shooter, Hanwha pick & place machine is a wide mounting range, 2 gantry x 6 head, 56,000 CPH. Satisfied with various mounting processes.