Specifications
- Alignment
- Fix Camera
- Number of Spindles
- 3 Spindles x 1 Gantry
- Placement Speed
- 11,000 CPH
- Component Range
- 0402 ~ □ 55 mm, ~ L74 mm x W55 mm (Size)
- Placement Accuracy
- ±40 μm @ Cpk ≥ 1.0 (Chip) / ±30 μm @ Cpk ≥ 1.0 (Lead/BGA)
Features
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High Productivity
- Flexible PCB processing capabilities
- Single Lane or Dual Lane can be used according to the user's use environment, and dual lane can be used for heterogeneous mixed production.
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High Reliability
- Poor component placement inspection (PBI)
- Check the mounting status of the shielding cover components to prevent defects in advance.
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High Reliability
- Back Light recognition
- It can correctly identify scattering and translucent components such as shields.
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High Reliability
- NPE (New Part editor)
- The automatic identification and registration system of components realized by dragging and dropping can be realized by clicking the mouse.
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