Currently, high-density interconnect HDI is increasingly used in ultra-high speed applications, which brings with it the challenges of optoelectronics and the integration of optical devices into printed circuits. It is expected that the compound annual growth rate of optical integrated circuit will be close to 40% by 2025, and the optical circuit board will keep the same growth rate.

This paper introduces the issues, materials and existing processes of integrated optoelectronic boards published by organizations in Europe, Japan and North America. In addition to introducing the major players in the global optoelectronic polymer field, this paper will also provide an overview of the current projects of three global groups:

· GuideLinkTM (DuPont, HP, OpticalinterLink, USA)

· TOPCat (NIST, 3M, Goodyear, USA)

· Truemode (Terahertz UK)

· OptoBump (NTT, Japan)

· JIEP (Japan)

- EOCB (University of Ulm, Fraunhafer Inst Institute, Daimler-Chrysler, Siemens, Europe)

- Terabus Project (IBM, Avago, USA)

- Integrated photoelectric interconnect PCB Manufacturing (UK)

· PhoxTroT: High Performance, Low Cost, Low Energy Data Centers and High Performance Computing Systems Optical Devices: Terabit/ S Optical Interconnect Technologies (Europe)

The introduction

This paper cannot provide a comprehensive overview of all the achievements and details of the development of photoelectric circuit boards since 2003. The e-book "Fiber-optic Data Communication Manual: A Practical Guide to Optical Networks" sums it up nicely. The 26th paper in the bibliography, "Optical Backboards, Boards, and Chip Interconnects," details the development of optoelectronic boards up to 2008, drawing on 43 excellent papers.

Photoelectric printed circuit based on HDI microhole technology, in addition to extremely high frequency electrical signals, also includes integrated optical waveguide requirements. Increasingly stringent cost targets are compounding the problems associated with today's smaller, denser, lighter and faster systems. When using optoelectronic products, the integrated waveguide transmission mode is the key.

Optical devices and electrical properties

The performance of traditional electrical interconnection technologies is limited by the underlying physical properties. Here are five obstacles to meeting the challenges of advanced electronics.

· Bandwidth and increasing data volume of Internet "packets" (Figure 1);

· Future challenges that require "massively parallel computing core" communication;

· Reduction of aviation, aerospace and automotive quality and power consumption;

· The data rate length product caused by attenuation and dispersion is limited and mainly affected by the high-frequency skin effect of dielectric materials and the frequency-related loss factor TAN;

· Due to the limited data rate of each interconnection, a large number of individual interconnections (pin count) at the component level and connector level increase, and chip I/O reaches CPU speed.

The increasing popularity of wireless devices and high-bandwidth applications has placed a huge burden on the Internet. For example, the data rate per channel of the PCIExpress (PCIe®) interface has increased from 2.5 Gbps in the 1.0 generation to 8.0 Gbps in the current 3.0 generation and is expected to increase to 16.0 Gbps in the 4.0 generation. Figure 1 shows Internet and IP traffic demand trends.

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