The variety of PCB in material, layer and process is suitable for different electronic products and their special needs, so there are many kinds of PCB.

The following is a summary of some general differences, to briefly introduce the classification of PCB and its manufacturing process. So let's analyze it from three aspects.

A, the material

1. Organic materials:

① Phenolic resin: phenolic resin is also called bakelite, also known as bakelite powder. Originally colorless or yellow brown transparent, market sales often add colorant and red, yellow, black, green, brown, blue and other colors, particles, powder.

Phenolic resin is resistant to weak acid and base, decomposition occurs in strong acid, corrosion occurs in strong base. Insoluble in water, soluble in acetone, alcohol and other organic solvents. Polycondensation of phenol aldehyde or its derivatives.

② Glass fiber: glass fiber (English original name: Glass fiber) is a kind of inorganic nonmetallic material with excellent performance. There are many kinds of glass fiber. The advantages are good insulation, strong heat resistance, good corrosion resistance, high mechanical strength, but the disadvantages are brittle and poor wear resistance.

It is quartz sand, limestone, dolomite, pyrophyllite and boron calcium stone, seven kinds of szaibelyite ore as raw material by high temperature melting system, wire drawing, winding, weaving and other manufacturing processes, the monofilament diameter of a few microns to over 20 microns, the equivalent of a human hair 1/20-1/5, each bundle fiber original SiDou consists of hundreds or even thousands of root monofilament.

Glass fiber is usually used as reinforced materials in composite materials, electrical insulation materials and thermal insulation materials, circuit board and other fields of national economy.

③ Polyimide: PI for short, appearance: Transparent liquid, powder, yellow brown granules, amber grain liquid polyimide resin, polyimide resin solution, polyimide resin powder, particles of polyimide resin, polyimide resin material grain, aggregate polyimide resin, thermoplastic polyimide resin solution, thermoplastic polyimide resin powder, thermosetting polyimide resin solution, Two, polyimide PI molding methods include: high temperature curing, compression molding, impregnation, spraying, calendering, injection molding, extrusion, die casting, coating, flow extension, lamination, foaming, transfer molding, molding.

And our epoxy resins and BT and so on are all organic materials.

2. Inorganic materials:

(1) Aluminum substrate: Aluminum substrate is a kind of metal base copper clad plate with good heat dissipation function. Generally, a single panel is composed of three layers.

They are circuit layer (copper foil), insulation layer and metal base. Common in LED lighting products. There are positive and negative sides, the white side is welded LED pin, the other side is aluminum color, generally daub heat conduction paste and heat conduction part contact. There are ceramic substrates and so on.

② Copper substrate: copper substrate is one of the most expensive metal substrate, the thermal conductivity effect is many times better than aluminum substrate and iron substrate, suitable for high frequency circuits and high and low temperature changes in the area and precision communication equipment heat dissipation and building decoration industry.

There are ceramic substrates are inorganic materials, as long as it is to take its heat dissipation function.

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